REVOLUTIONIZING RELIABILITY & THERMAL PERFORMANCE OF
HIGH-POWER HIGH-TEMPERATURE ELECTRONICS

Kuprion’s innovative ActiveCopper™ sintering pastes, adhesives, inks and gaskets are recognized for their tunable Coefficients of Thermal Expansion (CTEs) matching to a variety of substrates including ceramics, silicon, silicon carbide and more. Kuprion’s ActiveCopper™ formulations address the effects of thermal expansion, eliminating stresses caused by CTE mismatches for superior performance and reliability.

Kuprion’s ActiveCopper™ sintering pastes offer a robust lead-free alternative to lead-based solder, supporting RoHS compliance while providing improved thermal and electrical conductivity with superior fatigue resistance.

Designed to easily fit into standard electronic manufacturing processes, Kuprion’s ActiveCopper™ materials enable electronic devices to function reliably at higher power, higher voltages, higher frequencies and higher temperatures.

ENABLING ADVANCEMENTS IN TECHNOLOGY

AREAS OF EXPERTISE

Tunable ActiveCopper™ Solutions

Kuprion’s patented ActiveCopper™ solutions are engineered to be custom tuned to desired Coefficients of Thermal Expansion (CTEs), addressing the effects of thermal expansion. Matching the CTE of the bonding material to the substrate is critical to minimizing temperature induced stresses. CTE mismatches can result in fractures or cracks in a bonded structure, a common cause of permanent damage to semiconductor devices that experience high temperatures and extreme temperature fluctuations during operation.

High-Power High-Temperature Applications

Kuprion’s ActiveCopper™ solutions are driving advancements in electronics design and manufacturing. From automotive EV battery charging and discharging to high-frequency 5G telecommunications, Kuprion’s ActiveCopper™ formulations significantly improve heat transfer and cooling meeting the increased performance and reliability demands of advanced high-power, high-voltage, high-frequency and high-temperature electronics such as power modules, power ASICs, MOSFETs, IGBTs and more.

Heterogeneous Integration (HI) Technology

The evolution of IC packaging toward more functionality has led to heterogeneous multi-die chip stacking and integration into aggregate system-in-package assemblies. This trend has pressured the semiconductor industry to seek solutions to a variety of challenges including how to metallize interconnects between multiple die in the same package. Today’s high-performance computing demands complex 2.5D and 3D interposer technologies for fine-pitch micro-bumping and redistribution layers (RDLs). Kuprion’s ActiveCopper™ sintering materials are ideal for micro-bumping and via fill in glass or organic interposers.

Enabling Transition to SiC or GaN Semiconductors

Kuprion’s scientists and engineers are experts in high-thermal performance materials for high-power electronics. Our team can support your transition from traditional silicon-based semiconductor transistors to high-performance silicon carbide (SiC) or gallium nitride (GaN) based IGBTs. And with Kuprion’s tunable ActiveCopper™ sintering formulations, CTE can be matched to SiC or GaN for enhanced long-term reliability.

RoHS & REACH Certified

After processing, Kuprion’s ActiveCopper™ reverts to bulk copper, making it compliant with the European Union’s (EU’s) REACH and RoHS regulations to protect human health and the environment from risks posed by hazardous substances, such as lead, mercury, cadmium, polybrominated biphenyls and polybrominated diphenyl ethers in electronics. Kuprion’s ActiveCopper™ die attach pastes are excellent alternatives to lead-based solders.