Advanced Solutions for Demanding Industries
Kuprion designs and manufactures ActiveCopper™ material solutions for a variety of industries and a wide range of demanding applications.
Kuprion designs and manufactures ActiveCopper™ material solutions for a variety of industries and a wide range of demanding applications.
Electrical instrumentation and controls for power and industrial equipment must withstand high temperatures and harsh environments. Kuprion’s engineered copper materials enhance thermal and functional performance of power and industrial equipment. And Kuprion’s CTE tunable ActiveCopper™ can be formulated to match high bandgap SiC or GaN semiconductors, supporting the conversion of hydraulics and pneumatics to smart electromechanical controls and sensors that can operate in harsh industrial environments.
Today’s cars are packed with electronics that control everything from airbags to engine performance. From advanced driver assistance systems (ADAS) to EV batteries, these systems must endure high temperatures and harsh environments. Kuprion’s ActiveCopper™ solutions support the automotive industry, enabling more efficient, reliable and higher performance automotive electronics.
As technology advances, thermal management at the package level is more important than ever. The trend toward integrating and interconnecting heterogeneous ICs into high performance 2.5D and 3D packages demands improved heat transfer and cooling methods. When placed directly under a component that needs cooling, Kuprion’s copper thermal via paste opens a second heat dissipation conduit, doubling the cooling rate for superior performance and reliability. Kuprion’s ability to tune CTE to match interfacing materials, mitigates reliability issues common to other thermal via solutions.
Infrastructure for telecommunications, such as base stations and fixed wireless network devices, are located outdoors in harsh environments with large temperature swings, making robust thermal management critical for long-term reliable performance. As the industry transitions to 5G capabilities, increased performance expectations are pushing power densities to new limits. Kuprion’s novel ActiveCopper™ formulations support the telecommunications industry, enabling high power, high frequency, low latency systems.
Copper Sintering is ideal for aerospace applications, enabling mission critical satellite and aircraft systems to survive and endure harsh conditions, extreme temperature and pressure fluctuations, radiation and intense vibrations during takeoff and landing. Kuprion’s engineered copper materials meet the high demand of the aerospace industry. If fact, ActiveCopper™ began as research at Lockheed Martin to solve the challenges of reliable interconnects in space.
Integrated circuits (ICs) and power devices used in advanced military networks for logistics, intelligence, reconnaissance and high RF (radio frequency) signals require next-generation material solutions. For example, shielding for electromagnetic interference (EMI) has traditionally been managed at the board level. However, that alone no longer addresses today’s high RF challenges. Kuprion‘s advanced material solutions include sprayable copper inks that provide excellent system-level EMI protection and can be applied to a variety of materials in thicknesses of 1 to 50 microns.
Expanded functionality and shrinking dimensions are driving increased power densities in today’s consumer electronics. These trends have led to advanced SiP, 2.5D and 3D chip designs, making management of thermal and electrical performance more challenging. Kuprion’s ActiveCopper™ materials are ideal for metalizing interconnections between multiple chips in the same package. Whether its fine-pitch micro-bumping or via fill in glass or organic interposers, Kuprion has a solution.
Data centers are vital to the continuity of day-to-day operations of financial, government and commercial institutions and need modern, efficient and reliable infrastructure. Managing heat produced by continuous operation and high-power densities protects long-term reliability of high-speed data processing. Kuprion’s material solutions optimize the functional performance, efficiency and reliability of large data centers.
Generating power from sustainable energy sources like sun, wind and water is key to addressing global energy needs and reducing our reliance on fossil fuels. Kuprion’s is honored to offer advanced material technologies that remove heat to raise performance efficiency and deliver long-term reliable energy conversion, output and storage for green energy systems.
Electronics continue to extend their reach into the medical and healthcare industry. Whether it is medical imaging systems, heart monitoring, or wearable medical devices, they have one commonality – they depend on fail-safe electronics. Kuprion’s advanced ActiveCopper™ materials, available as printable inks, prevent failures by creating rugged and reliable printed electronic circuits on a variety of biocompatible substrates.